Qualcomm is hiring Interim Engineering Intern 2025

Role Overview:
Join Qualcomm’s team of inventive minds working on cutting-edge hardware and systems, contributing to areas such as:

• SoC & Hard Macro Physical Design
• SoC Validation & Debug
• RF & Analog Layout
• RF/Analog/Mixed Signal/Power IC Design
• Low Power Design
• Board and FPGA Design
• Digital ASIC Design
• Design/SOC Verification
• CAD Solution Engineering
• Design for Test (DFT)
• CPU Design

Key Responsibilities and Requirements:

• Verify SoCs with embedded RISC/DSP processors and networking ASICs.
• Work with Verilog or VHDL, C/C++, Tcl/Perl/Shell-scripting; RTL design or strong object-oriented programming knowledge.
• Understand wireless/wired communications and protocols or graphics/video multimedia (preferred).
• Design with PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or Layout for RF/Analog/Mixed Signal IC.
• Showcase excellent analytical, problem-solving, and teamwork abilities.
• Demonstrate strong verbal and written communication skills.

Educational Requirements:

• Bachelors or Masters in Electrical Engineering, VLSI, Embedded and VLSI, or ECE.

Eligible Batches:

• 2025, 2024

Technical Skills Required:
Verilog, VHDL, C, C++, Tcl, Perl, Shell Scripting, RTL Design, Object-Oriented Programming, Cadence, SpectreRF, CMOS, ADC/DAC, PLL, RF IC Design, Analog Layout, FPGA Design, ASIC Design, Design Verification, DFT, Low Power Design.

Equal Opportunity Employer:
Qualcomm is committed to diversity and inclusivity. The company ensures reasonable accommodations during the hiring process and aims to provide an accessible workplace for individuals with disabilities.